Author/Authors :
Ghosh، نويسنده , , S. and Ghosh، نويسنده , , A. and Kar، نويسنده , , T. and Das، نويسنده , , S. and Das، نويسنده , , P.K. and Banerjee، نويسنده , , R.، نويسنده ,
Abstract :
Here we report enhanced hardness, fracture toughness and thermal conductivity of single walled carbon nanotubes (SWCNT) embedded lead silicate glass composite. The enhanced hardness of the composite was due to cushioning behavior of the agglomerated SWCNT bundles where as the increment in toughness is due to crack bridging and accumulation of SWCNT bundles around the crack zone. Interestingly the accumulation of SWCNT bundles which was hitherto not yet been observed was due to enhanced localized plastic flow in the composite. Moreover, moderate increment of thermal conductivity above room temperature was discussed in the context of interfacial thermal resistance.