Author/Authors :
Liu، نويسنده , , Yueqin and Zhang، نويسنده , , Genli and Sun، نويسنده , , Huan and Sun، نويسنده , , Xiangying and Jiang، نويسنده , , Nisi and Rasool، نويسنده , , Aamir and Lin، نويسنده , , Zhanglin and Li، نويسنده , , Chun، نويسنده ,
Abstract :
In this study, thermo-tolerant devices consisting of heat shock genes from thermophiles were designed and introduced into Saccharomyces cerevisiae for improving its thermo-tolerance. Among ten engineered thermo-tolerant yeasts, T.te-TTE2469, T.te-GroS2 and T.te-IbpA displayed over 25% increased cell density and 1.5–4-fold cell viability compared with the control. Physiological characteristics of thermo-tolerant strains revealed that better cell wall integrity, higher trehalose content and enhanced metabolic energy were preserved by thermo-tolerant devices. Engineered thermo-tolerant strain was used to investigate the impact of thermo-tolerant device on pathway efficiency by introducing β-amyrin synthesis pathway, showed 28.1% increased β-amyrin titer, 28–35 °C broadened growth temperature range and 72 h shortened fermentation period. The results indicated that implanting heat shock proteins from thermophiles to S. cerevisiae would be an efficient approach to improve its thermo-tolerance.
Keywords :
thermophiles , thermo-tolerance , Thermo-tolerant devices , S. cerevisiae , Heat shock proteins (HSPs)