Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C

Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10 wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100 °C. Sintering on these printed nanoplates at a low temperature (100 °C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3 μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3 × 105 μΩ-cm.