Title of article
Effect of Cu Content on TiN-Cu Nanocomposite Film Properties: Structural and Hardness Studies
Author/Authors
Larijani، M. M. نويسنده Radiation application Research School, Nuclear Science &Technology Research Institute (NSTRI), Atomic Energy Organization of Iran (AEOI), Karaj, Iran , , Balashabadi، P. نويسنده Radiation application Research School, Nuclear Science &Technology Research Institute (NSTRI), Atomic Energy Organization of Iran (AEOI), Karaj, Iran , , Seyedi، H. نويسنده Radiation application Research School, Nuclear Science &Technology Research Institute (NSTRI), Atomic Energy Organization of Iran (AEOI), Karaj, Iran , , Jafari-.Khamse، E. نويسنده Department of physics, Kashan University, Kashan, Iran ,
Issue Information
فصلنامه با شماره پیاپی 0 سال 2013
Pages
6
From page
237
To page
242
Abstract
لايه نازك نيتريد تيتانيوم-مس با روش رسوب گذاري فيزيكي بخار توسط دستگاه لايه نشاني يوني مجهز به تفنگ تخليه الكتريكي كاتد توخالي در دماي زيرلايه C?350 بر روي زيرلايه استيل316 لايه نشاني شد. تاثير ميزان مس در بازه 7-2 د ر صد بر ساختار ريز ، مورفولوژي و خواص مكانيكي لايه نيتريد تيتانيوم–مس بررسي شد. جهت مشخصه يابي نمونه ها آناليز تفرق اشعه ايكس(XRD)، ميكروسكوپ الكتروني روبشي(SEM)، طيف سنجي تفرق انرژي اشعه ايكس (EDX) و ميكروسكوپ نيروي اتمي(AFM) مورد استفاده قرار گرفت. اندازه گيري نانوسختي و ضريب الاستيسيته به روش دندانه گذاري نانويي انجام شد. نتايج نشان مي دهند با افزودن فاز نرم مس به لايه NiT، سختي لايه هاي TiN ازGPa 30 به GPa 8/2 به سبب اثر روان كننده ذرات مس بين دانه هاي فاز سخت TiN كاهش مي يابد. نتايج آناليز تفرق اشعه ايكس نشان مي دهند كه فاز هاي مس و نيتريد تيتانيم به طور جداگانه رشد نموده و پيوند شيميايي بين اتم هاي مس و تيتانيم تشكيل نمي گردد.
Abstract
Titanium nitride-Copper (TiN-Cu) nanocomposite films were
deposited onto stainless steel substrate using hollow cathode
discharge ion plating technique. The influence of Cu content in the
range of 2-7 at.% on the microstructure, morphology and mechanical
properties of deposited films were investigated. Structural properties
of the films were studied by X-ray diffraction pattern. Topography
of the deposited films was studied using atomic force microscopy.
Film hardness was estimated by a triboscope nanoindentation
system. However, X-ray photoelectron spectroscopy analysis was
performed to study the surface chemical bonding states. It was found
that addition of soft Cu phase above 2 at.% to TiN film drastically
decreased the film hardness from 30 to 2.8 Gpa due to lubricant
effect of segregated copper particles. X-ray photoelectron
spectroscopy results showed that Cu and TiN phases grew
separately. In our case,the formation of a solid solution or chemical
bonding between Cu and Ti was rejected.
Journal title
Journal of NanoStructures
Serial Year
2013
Journal title
Journal of NanoStructures
Record number
1984126
Link To Document