Effect of Thickness on the Structural Properties of Tellurium Film Prepared by Thermal Evaporation

در اين پژوهش، فيلم تلوريوم با ضخامت 100 تا 250 نانومتر با روش تبخير حرارتي بر روي زيرلايه سراميكي در دماي K373 نشانده شد. ضخامت فيلم با روش Rutherford backscattering اندازه گيري شد. تاثير ضخامت بر روي ساختار، مورفولوژي و پيوندهاي مولكولي با روش هاي XRD، SEM و رامان مورد بررسي قرار گرفت. نتايج XRD افزايش بلورينگي را در اثر افزايش ضخامت فيلم نشان داد. تصاوير SEM نشان داد كه دانسيته فيلم و حفره ها با افزايش ضخامت، كاهش مي يابند. طيف سنجي رامان نيز نشان داد كه تنها در دماي اتاق پيوندهاي مولكولهاي TeO2 بر روي سطح تشكيل مي شوند.

In this research, tellurium (Te) film with thicknesses of 100- 250 nm were deposited on ceramic substrates by thermal evaporation at 373 K. The thickness of the film was determined by Rutherford backscattering spectroscopy. The influence of the thickness on the structural, morphological and molecular bonds was characterized using XRD, scanning electron microscope, and Raman spectroscopy. The XRD results confirmed that increasing the thickness, increased the intensity of the peaks, indicating increased crystallinity. SEM images indicated that the density of the film and holes in the film decreased as thickness increased. The Raman spectrum revealed that the TeO2 molecular bond formed on the surface only at room temperature up to 100 nm in thickness; as thickness increased, this bond was observed at 323 K.