• Title of article

    Technologies of Multi Chip Module (MCMs)

  • Author/Authors

    Boddepalli، Eshwararao نويسنده Aditya Institute of Technology and Management, Tekkali, Srikakulam ,

  • Issue Information
    روزنامه با شماره پیاپی 2 سال 2012
  • Pages
    3
  • From page
    227
  • To page
    229
  • Abstract
    In the past few years, impressive progress in electronic devices and their packing have been achieved. High energy physicists benefit from this, being able to minimize the amount of materials in their Vertex detectors. MCMs (Multi- Chip Modules) are the latest advanced technologies which are using in FPGA (Field Programmable Gate Array) routing purpose. This paper tries to give a short overview of the existing Multi chip modules used in Routing of an FPGA and focus on the prototyping results of an upcoming multi chip module technologies, called as (multi chip module) MCM_L, MCM_C and MCM_D. By using these technologies the routing complexity reduced and thermal, chemical, mechanical and material effects reduced while comparing with the PCB and IC designing using CAD (Computer Aided Design) tools.
  • Journal title
    International Journal of Electronics Communication and Computer Engineering
  • Serial Year
    2012
  • Journal title
    International Journal of Electronics Communication and Computer Engineering
  • Record number

    1994018