Author/Authors :
Humpston، نويسنده , , G. and Needham، نويسنده , , A.P.، نويسنده ,
Abstract :
Flip-chip solder bonding is becoming the established method for interconnection of high performance semiconductor devices. It is used for the assembly of pixelated detectors, multi-chip modules (MCMs) and monolithic microwave integrated circuits (MMICs). The process has self-aligning features that result in closely dimensioned and highly reproducible array interconnections.
