Thermal Control Methods for Reducing Heat in 3D ICs - TSV (Through-Silicon-Via)

In Via thermal silicon 3D ICs, several stacked templates are facing the severe challenge of thermal effect caused by low thermal conductivity of medium dielectrics and high energy density. In this paper, a thermal controlling method with an ambient temperature sensor is proposed for TSV (through-silicon-via) the three-dimensional IC. TSV and thermal heat shield rings are used as well. Depending on thermal heat shield rings and thermal TSV, analytical model is presented for on-chip thermal distribution in each of the heat regions in this article. Based on the analytical model, the compensating temperature between hot spots (Hotspot) in the heating and heat shield ring is calculated. Therefore, the ambient temperature sensor is placed near the thermal shield so as to analyze the temperature and transfer thermal data to the system. The results of simulated thermal mechanism along with ambient temperature sensor indicate that it has decreased the temperature and analyzes the thermal dissipation TSV of 3D ICs in an extraordinary way. This approach can be promoted to balance the workload of the whole system in order to reduce the temperature.