Title of article :
Current trends on design and assembly of pixel detector systems in biomedicine and high-energy physics
Author/Authors :
Caria، نويسنده , , M، نويسنده ,
Pages :
11
From page :
167
To page :
177
Abstract :
The design and assembly of an integrated system made of pixel sensors as sensitive elements combined with read-out electronics and connecting cables or alternative connecting structures, is discussed. The new trends are summarised and critically evaluated. It is shown that many problems are common to High-Energy Physics and Biomedical devices and that this cross-interaction is profitable. Technological choices on new highly integrated modules are presented, with the first successful cases and the risks of failure.
Keywords :
Bump bonding , VLSI read-out , Multi-chip modules , MCM , Pixel detectors
Journal title :
Astroparticle Physics
Record number :
2012227
Link To Document :
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