Author/Authors :
Jordanov، نويسنده , , Valentin T. and Macri، نويسنده , , John R. and Clayton، نويسنده , , James E. and Larson، نويسنده , , Kipp A.، نويسنده ,
Abstract :
Polymer flip chip bonding has been used to package a multi-electrode CZT detector. During the packaging process the temperature of all components was kept less than 80°C. The size of the conductive epoxy eontacts is less than 120 μm in diameter. Thermal cycling, and random and structural vibration tests indicate reliable detector–substrate interconnection and rugged construction.
Keywords :
Epoxy bonding , CZT detectors , Flip-Chip bonding , Detector packaging