Title of article :
Experience with mass production bump bonding with outside vendors in the CMS FPIX project
Author/Authors :
Merkel، نويسنده , , Petra، نويسنده ,
Abstract :
The experience with mass production bump bonding with outside vendors gained in the CMS Forward Pixel project is discussed. Results from two different vendors are presented. After an initial R&D and pre-production phase, 20% of the production parts have been completed. The main results are shown here.
Keywords :
CMS , pixel , Bump bonding , Silicon
Journal title :
Astroparticle Physics
