Title of article :
Fatigue crack nucleation assisted by thermal activation
Author/Authors :
Fine، نويسنده , , M.E and Stolkarts، نويسنده , , V and Keer، نويسنده , , L.M، نويسنده ,
Pages :
5
From page :
5
To page :
9
Abstract :
Experimental evidence is presented that very early in the fatigue lifetime of Sn–Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equations for nucleation in phase transformations. Predictions of the model are in good agreement with nucleation data for this solder.
Keywords :
Fatigue , Crack , activation , thermal , Solder , Nucleation
Journal title :
Astroparticle Physics
Record number :
2055336
Link To Document :
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