Title of article
Diffusion bonding of a Cu–Cr–Zr alloy to stainless steel and tungsten using nickel as an interlayer
Author/Authors
Batra، نويسنده , , I.S. and Kale، نويسنده , , G.B. and Saha، نويسنده , , T.K and Ray، نويسنده , , A.K. and Derose، نويسنده , , J. and Krishnan، نويسنده , , J.، نويسنده ,
Pages
5
From page
119
To page
123
Abstract
In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that of the sintered tungsten used in this work.
Keywords
Diffusion bonding , Cu–Cr–Zr alloy , Stainless steel , Tungsten , EPMA
Journal title
Astroparticle Physics
Record number
2063536
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