• Title of article

    About the measurement of dynamic mechanical properties of bi-layer systems

  • Author/Authors

    Goyanes، نويسنده , , S.N. and Roncaglia، نويسنده , , A. and Saavedra، نويسنده , , F. and Rubiolo، نويسنده , , G.H.، نويسنده ,

  • Pages
    4
  • From page
    431
  • To page
    434
  • Abstract
    The bi-layer system has been well developed for many engineering structural components in the aircraft, automotive, microelectronics and modern space industries in the last few decades. Consequently, a good determination of its dynamic mechanical properties is important for an appropriate design of its industrial application. These studies are usually performed by a three-point bending test using a dynamic mechanical analyzer (DMA). In this work, we show that the three points bending test on a bi-layer system carried out with the test tool provided in a commercial DMA, for example the dynamic mechanical thermal analyzer (DMTA) Rheometric IV, can lead to erroneous results. Measurements on polymer-hard substrate bi-layer systems around the glass transition temperature of the polymer, Tg, give larger changes in elastic modulus and loss tangent than they are. This problem is not observed at temperatures lower than Tg. The design of new test tool and specimen geometry for the three points bending test is shown together with its application to the measurement of the dynamic elastic properties of a polyvinyl chloride (PVC)–aluminum bi-layer system.
  • Keywords
    Dynamic mechanical analyzer , Three points bending test , Loss tangent , Polymer-hard substrate bi-layer systems , Complex bending stiffness
  • Journal title
    Astroparticle Physics
  • Record number

    2063734