Effect of transient liquid-phase bonding variables on the properties of a micro-duplex stainless steel

The TLP bonding process has been used to join a 2205 micro-duplex stainless steel using a pure copper interlayer and a foil based on the Fe–B–Si ternary system. Joints were produced by isothermal solidification when using these interlayers, and the rapid heating and cooling cycles used during bonding suppressed the formation of σ-phase within the joint region. Metallographic examination of the bonds show that a homogeneous microstructure with grain growth and good α/γ phase balance across the bond-line was achieved, and this gave the joint mechanical and corrosion-resistant properties similar to that of the parent alloy.