MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS

In this study an algorithm for mold-filling simulation with consideration of surface tension has been developed based on a SOLA VOF scheme. As the governing equations, the Navier-Stokes equations for incompressible and laminar flows were used. We proposed a way of considering surface tension in mold-filling simulation. The proposed scheme for surface tension was based on the continuum surface force (CSF) model; we could confirm the remarkable effectiveness of the surface tension by experiment which concluded in very positive outcome