Research of silver plating nano-graphite filled conductive adhesive

In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled conductive adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the adhesive to be cured completely at 120 °C. The electrically conductive adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the conductive adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the conductive filler was 20 wt%. TGA indicated that the conductive adhesive exhibited good thermal stability.