Title of article :
Preparation of copper nanoparticles on carbon nanotubes by electroless plating method
Author/Authors :
Xu، نويسنده , , Cailu and Wu، نويسنده , , Gongwei and Liu، نويسنده , , Zheng and Wu، نويسنده , , Dehai and Meek، نويسنده , , Thomas A. and Han، نويسنده , , Qingyou، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Abstract :
Densely distributed copper nanoparticles have been deposited on the surface of carbon nanotubes with a size of ∼10 nm by the electroless plating method. It has been found that the pretreatment of the carbon nanotubes is very important to obtain the copper nanoparticles on the carbon nanotubes; in our experiments, one-step pretreatment of mixed HNO3 and H2SO4 was found effective. In order to attain nanosized copper particles, the electroless plating parameters should be closely controlled; e.g., the pH value of the plating solution, the temperature, and the concentration and titrating speed of HCOH were critical.
Journal title :
Materials Research Bulletin
Journal title :
Materials Research Bulletin