Field-configured self-assembly: manufacturing at the mesoscale

We describe a new method, Field-Configured Assembly (FCA), which enables programmed heterogeneous integration of functional mesoscale devices at technologically relevant substrates. To highlight the potential of this new mesoscale manufacturing method, we show that 50-μm-diameter GaAs-based light-emitting diode devices may be successfully manipulated in a high throughput, tweezer-less manner and assembled at selected receptor electrode sites patterned onto an electronically addressable silicon chip. Following assembly, devices may be permanently integrated on-chip by solder reflow bonding to enable direct and reliable electrical interfacing.