Title of article :
Polymer films with surfaces unmodified and modified by non-thermal plasma as new substrates for cell adhesion
Author/Authors :
Borges، نويسنده , , A.M.G. and Benetoli، نويسنده , , L.O. and Licيnio، نويسنده , , M.A. and Zoldan، نويسنده , , V.C. and Santos-Silva، نويسنده , , M.C. and Assreuy، نويسنده , , J. and Pasa، نويسنده , , A.A. and Debacher، نويسنده , , N.A. and Soldi، نويسنده , , V.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Abstract :
The surface properties of biomaterials, such as wettability, polar group distribution, and topography, play important roles in the behavior of cell adhesion and proliferation. Gaseous plasma discharges are among the most common means to modify the surface of a polymer without affecting its properties. Herein, we describe the surface modification of poly(styrene) (PS) and poly(methyl methacrylate) (PMMA) films using atmospheric pressure plasma processing through exposure to a dielectric barrier discharge (DBD). After treatment the film surface showed significant changes from hydrophobic to hydrophilic as the water contact angle decreasing from 95° to 37°. All plasma-treated films developed more hydrophilic surfaces compared to untreated films, although the reasons for the change in the surface properties of PS and PMMA differed, that is, the PS showed chemical changes and in the case of PMMA they were topographical. Excellent adhesion and cell proliferation were observed in all films. In vitro studies employing flow cytometry showed that the proliferation of L929 cells was higher in the film formed by a 1:1 mixture of PS/PMMA, which is consistent with the results of a previous study. These findings suggest better adhesion of L929 onto the 1:1 PS/PMMA modified film, indicating that this system is a new candidate biomaterial for tissue engineering.
Keywords :
Non-thermal plasma , Cell Proliferation , L929 fibroblasts , Poly(styrene) , poly(methyl methacrylate)
Journal title :
Materials Science and Engineering C
Journal title :
Materials Science and Engineering C