Title of article :
Assessment of reinforced poly(ethylene glycol) chitosan hydrogels as dressings in a mouse skin wound defect model
Author/Authors :
Chen، نويسنده , , Szu-Hsien and Tsao، نويسنده , , Ching Ting and Chang، نويسنده , , Chih-Hao and Lai، نويسنده , , Yi –Ting and Wu، نويسنده , , Ming-Fung and Chuang، نويسنده , , Ching-Nan and Chou، نويسنده , , Hung-Chia and Wang، نويسنده , , Chih-Kuang and Hsieh، نويسنده , , Kuo Haung، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Pages :
11
From page :
2584
To page :
2594
Abstract :
Wound dressings of chitosan are biocompatible, biodegradable, antibacterial and hemostatic biomaterials. However, applications for chitosan are limited due to its poor mechanical properties. Here, we conducted an in vivo mouse angiogenesis study on reinforced poly(ethylene glycol) (PEG)-chitosan (RPC) hydrogels. RPC hydrogels were formed by cross-linking chitosan with PEGs of different molecular weights at various PEG to chitosan ratios in our previous paper. These dressings can keep the wound moist, had good gas exchange capacity, and was capable of absorbing or removing the wound exudate. We examined the ability of these RPC hydrogels and neat chitosan to heal small cuts and full-thickness skin defects on the backs of male Balb/c mice. Histological examination revealed that chitosan suppressed the infiltration of inflammatory cells and accelerated fibroblast proliferation, while PEG enhanced epithelial migration. The RPC hydrogels promoted wound healing in the small cuts and full layer wounds. The optimal RPC hydrogel had a swelling ratio of 100% and a water vapor transmission rate (WVTR) of about 2000 g/m2/day. In addition, they possess good mechanical property and appropriate degradation rates. Thus, the optimal RPC hydrogel formulation functioned effectively as a wound dressing and promoted wound healing.
Keywords :
Hydrogel , Wound dressing , PEG , Chitosan , mice
Journal title :
Materials Science and Engineering C
Serial Year :
2013
Journal title :
Materials Science and Engineering C
Record number :
2103095
Link To Document :
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