Title of article :
Softening of the elastic modulus in submicrocrystalline copper
Author/Authors :
Lebedev، نويسنده , , A.B. and Burenkov، نويسنده , , Yu.A. and Romanov، نويسنده , , A.E. and Kopylov، نويسنده , , V.I. and Filonenko، نويسنده , , V.P. and Gryaznov، نويسنده , , V.G.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1995
Abstract :
Youngʹs modulus of copper polycrystals with an ultrafine-grained structure synthesized by two independent methods (compacting and heavy plastic deformation) has been measured within a temperature range from 20 to 200–300°C. It has been concluded that there is a component of the Youngʹs modulus softening which is peculiar to metals with nano- and submicrocrystalline structures, irrespective of the presence of porosity.
Keywords :
Polycrystals , Deformation , Youngיs modulus softening , Copper
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
