Room temperature creep behavior of nanocrystalline nickel produced by an electrodeposition technique

Deformation processes of nanocrystalline (6–40 nm) nickel produced by an electrodeposition technique were studied. First, the results of unidirectional tensile tests were discussed with respect to the deviation from the Hall-Petch relationship. It was suggested that such a mechanical behavior exhibited by nanocrystalline materials could be described by a composite model proposed previously. Further experimental work on static and dynamic creep tests under the load control condition showed that nanocrystalline nickel electrodeposits exhibited a significant room temperature creep behavior. It appeared that grain boundary sliding and diffusive matter transport within the intercrystalline region played an important role in terms of deformation mechanisms of nanocrystalline materials. The contributions of dynamic creep to stress-strain behavior and, in turn, to the assessment of the Hall-Petch relationship for nanocrystalline materials are discussed.