Title of article :
Phase-field modeling of rapid solidification
Author/Authors :
Kim، نويسنده , , Seong Gyoon and Tae Kim، نويسنده , , Won، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Pages :
6
From page :
281
To page :
286
Abstract :
Rapid directional solidification under a constant thermal gradient was simulated by a new phase-field model. The banded structures in an Al–Cu alloy were successfully reproduced. Only a few cells or dendrites survive in every transition steps into the plane-front mode, which explains the large grain size of banded structure observed in experiments. The noise level in concentration plays a crucial role in the transition procedure of the cell/dendrite into the plane-front mode and so in the overall pattern formation of the banded structure.
Keywords :
Rapid solidification , phase-field model , Banded structure
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2001
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2136720
Link To Document :
بازگشت