Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites

We report on the effects of hydrothermal ageing on the dielectric properties of epoxy-silica composites used for microelectronic packaging. The study was carried out for samples with various degrees of curing. Epoxy compounds were subjected to moisture exposure (standard JEDEC procedures) and consecutive thermal stress (240°C). Changes in the dielectric constant and in the loss factor were measured in the 100 Hz–100 kHz frequency range. It is found that water absorption increases with curing. After ageing the dielectric constant is decreased and the loss factor increased. Cured materials have a higher resistance against hydrothermal ageing.