Title of article :
Volume and grain boundary diffusivity of boron in polycristalline silicon during rapid thermal annealing
Author/Authors :
Merabet، نويسنده , , A. and Gontrand، نويسنده , , C.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
5
From page :
257
To page :
261
Abstract :
The diffusion of boron and arsenic from polycristalline silicon into single crystal silicon during rapid thermal annealing (RTA) at temperature between 1000 and 1150 °C for 20 s has been investigated. Samples were characterised by secondary ion mass spectrometry (SIMS). The volume and intergranular diffusion coefficient has been deduced from the boron profiles. Depth profiles are analysed using the Suzuoka model. It is established that the grain boundary diffusivities are two to three times larger than the volume diffusivities.
Keywords :
Metal-oxide-semiconductor , Ion implantation , Annealing , Secondary ion mass spectroscopy (SIMS) , Grain boundaries , diffusion
Journal title :
MATERIALS SCIENCE & ENGINEERING: B
Serial Year :
2003
Journal title :
MATERIALS SCIENCE & ENGINEERING: B
Record number :
2139515
Link To Document :
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