Title of article
On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications
Author/Authors
Yan، نويسنده , , J and Yoshino، نويسنده , , M and Kuriagawa، نويسنده , , T and Shirakashi، نويسنده , , T and Syoji، نويسنده , , K and Komanduri، نويسنده , , R، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
5
From page
230
To page
234
Abstract
The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (−40°) and a high side cutting edge angle (SCEA) (∼88°) and undeformed chip thickness in the nanometric range (∼50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (∼400 MPa) apparatus.
Keywords
Silicon , Ultra-precision machining , Ductile machining , hydrostatic pressure
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2001
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2139694
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