Organic–inorganic hybrid materials based on the incorporation of nanoparticles of polysilicic acid (nPSA) with organic polymers: 2. Curing of unsaturated poly(amide-ester) resin in the presence of nPSA

Two types of transparent organic–inorganic hybrid materials have been prepared through heat curing of N,N-dimethylacrylamide (NDMA) solution of unsaturated poly(amide-ester) (UPAE) resin (UPAE/NDMA resin) in the presence of nanoscaled polysilicic acid (nPSA) and G-nPSA obtained by modification of nPSA with 3-glycidyloxypropyltrimethoxysilane (GPTS). The curing reaction and interfacial behavior of the hybrids were studied by infrared and NMR spectroscopy. The presence of nPSA and G-nPSA enhanced the thermal properties and dynamic mechanical properties of the hybrids, and the property enhancement was particularly evident for G-nPSA containing system because of the existence of the additional COC covalent bonding between the organic and inorganic phases. The curing shrinkage of UPAE/NDMA/nPSA and UPAE/NDMA/G-nPSA hybrids reduced with the increasing of nPSA and G-nPSA contents.