Title of article
Observation of twin boundary migration in copper during deformation
Author/Authors
Field، نويسنده , , D.P. and True، نويسنده , , B.W. and Lillo، نويسنده , , T.M. and Flinn، نويسنده , , J.E.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
7
From page
173
To page
179
Abstract
A previous investigation produced evidence that twin boundaries in annealed copper were a significant source of dislocations during the initial stages of plastic flow. The character of the dislocation source was unknown, but it was hypothesized that twin boundaries could be non-regenerative dislocation sources that would cause migration of the boundary during plastic deformation. Channel die deformation and intermittent orientation imaging were performed on split specimens of pure copper in an attempt to observe twin boundary migration. Approximately 15% of the twin boundaries were observed to migrate beyond that expected from the imposed strain. The data support the hypothesis that twin boundaries can serve as dislocation sources.
Keywords
Twin boundaries , Copper , electron backscatter diffraction (EBSD) , Deformation
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2004
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2143831
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