Behavior of joining interface between thin film metallic glass and silicon nitride at heating

Thin film metallic glass is usually deposited directly on a substrate. The strength of the adhesive join between the substrate surface and the thin film metallic glass is important for fabrication of micro- and/or nano-electromechanical systems. The strength of the join is especially affected by the stresses at the interface, created by the thermal history during the fabrication process and/or during use. In the present study, a bimetallic cantilever of silicon nitride film with a Pd-based thin film metallic glass was fabricated and heated under vacuum in order to generate high stresses at the joining interface. The behavior at the interface were observed and analyzed in terms of the projected length of the cantilever.