Application of Al2O3-based polyimide composite thick films to integrated substrates using aerosol deposition method

Al2O3-based polyimide composite thick films were successfully fabricated with reduction of residual stress and improvement in plasticity for integrated substrates at room temperature by aerosol deposition method. Scanning electron microscopy and energy dispersive spectroscopy mappings exhibited a high content of Al2O3 evenly distributed in the composite thick films. The relative dielectric permittivity and loss tangent of Al2O3-based polyimide composite thick films were 7.6 and 0.007, respectively. There was almost no change in the crystallite size of Al2O3-based polyimide composite thick films compared with that of starting powder due to the reduction of kinetic energy by polyimide during collision on the substrates. Moreover, it was confirmed that the residual stress of Al2O3-based polyimide composite thick films remarkably decreased compared with that of Al2O3 thick films.