Comparison of different electrochemical deposits for contact metallization of silicon solar cells

The aim of the present work is to compare deposits made by electroless nickel–phosphorous (Ni–P) from two different baths and to see how it can be used for the fabrication of solar cell contacts: deposition on screen-printed contacts or directly on silicon as seed layer for subsequent electrolytic deposition of copper or silver. N-type silicon samples were plated, so as to study the feasibility of such deposits (homogeneity, adhesion). Scanning electron microscope (SEM) and contact resistivity measurements by transmission line model (TLM) were used to check the quality of the deposits. Dark I–V characteristics and external quantum efficiency have also been performed on standard silicon solar cells before and after Ni–P deposition on screen-printed contacts.