Title of article
Lattice defect investigation of ECAP-Cu by means of X-ray line profile analysis, calorimetry and electrical resistometry
Author/Authors
Schafler، نويسنده , , E. and Steiner، نويسنده , , G. F. Korznikova، نويسنده , , E. and Kerber، نويسنده , , M. J. Zehetbauer، نويسنده , , M.J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
5
From page
169
To page
173
Abstract
Cu rods have been deformed by equal channel angular pressing (ECAP) up to shear strains γ ≈ 5 while applying various deformation paths A, BC and C. X-ray Bragg profile analyses (XPA), differential scanning calorimetry (DSC) as well as residual electrical resistivity (RER) measurements have been performed, in order to detect the densities of various deformation induced lattice defects and/or their arrangements. The results have been analysed in terms of annealing of deformation induced dislocations and vacancies (vacancy agglomerates). Compared to conventional cold work procedures, deformation by ECAP achieves a strongly enhanced concentration of vacancy type defects.
Keywords
Nanostructures , Lattice defect annealing , Severe plastic deformation , Deformation induced vacancies
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2005
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2147358
Link To Document