• Title of article

    Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

  • Author/Authors

    Lee، نويسنده , , Ho-Young and Park، نويسنده , , Young-Bae and Jeon، نويسنده , , Insu and Kim، نويسنده , , Yong-Hyup and Chang، نويسنده , , Young-Keun، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    15
  • From page
    50
  • To page
    64
  • Abstract
    Two kinds of nanobelts were coated on the surface of a copper-based leadframe by immersion of leadframe in two kinds of hot alkaline solutions. The nanobelt-coated leadframe sheets were molded with epoxy molding compound (EMC), and the molded bodies were machined to form pull-out test specimens for the purpose of measuring the adhesion strength of the nanobelt-coated leadframe/EMC interfaces. After the pull-out tests, fracture surfaces were analyzed by various techniques to determine the failure path, and the failure path trajectory was studied using finite element (FE) modeling. FE analysis revealed that the shear component plays an important role in determining the failure path of the B-nanobelt-coated copper-based leadframe/EMC system after pull-out tests, and it did not affect the failure path of the A-nanobelt-coated copper-based leadframe/EMC system.
  • Keywords
    Phase Angle , Nanobelt , Leadframe , Epoxy , Failure path , Adhesion
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2005
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2148719