Title of article :
The fast diffusion paths of copper atoms in Al–Cu–Si alloys
Author/Authors :
Zhang، نويسنده , , Dingfei and Peng، نويسنده , , Jian and Liu، نويسنده , , Tianmu، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Pages :
5
From page :
78
To page :
82
Abstract :
Copper diffusivities were measured in both α single phase and α plus silicon phase Al–Cu–Si alloys by diffusion couple experiments. The results exhibits that copper atoms has much faster diffusion rate in the α plus silicon phase Al–Cu–Si alloy than in the α single phase Al–Cu–Si alloy, which means silicon phase plays an important role in copper diffusion in the alloy. Copper has very high diffusivity in the silicon phase, silicon particles become shortcuts for copper diffusion in the alloy. How much the silicon phase can increase copper diffusivity depends on siliconʹs volume percentage and morphology.
Keywords :
Copper , diffusion , Silicon , Al–Cu–Si alloys , Phase
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2006
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2149796
Link To Document :
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