• Title of article

    Dynamic simulation of solid-state diffusion bonding

  • Author/Authors

    Wu، نويسنده , , G.Q. and Li، نويسنده , , Z.F. and Luo، نويسنده , , G.X. and Li، نويسنده , , H.Y. and Huang، نويسنده , , Z.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2007
  • Pages
    7
  • From page
    529
  • To page
    535
  • Abstract
    By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.
  • Keywords
    MODELING , diffusion , surface , Diffusion bonding , microstructure
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2007
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2151651