Title of article
Evidence for the intergranular segregation of tin to grain boundaries of a Cu–Sn alloy and its consequences for dynamic embrittlement
Author/Authors
Liu، نويسنده , , XinYu and Tham، نويسنده , , Douglas M. Yates، نويسنده , , Douglas and McMahon Jr.، نويسنده , , Charles J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
3
From page
123
To page
125
Abstract
Observations by STEM and EELS have provided evidence of intergranular segregation of tin in a slowly cooled Cu–8%Sn alloy. Aging of this alloy at 250 °C was found to increase the susceptibility to dynamic embrittlement, which would be consistent with increased tin segregation at this temperature.
Keywords
Cu–Sn alloy , Intergranular segregation , Dynamic embrittlement
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2007
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2152355
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