The fabrication and property of SiC fiber reinforced copper matrix composites

SiC fiber reinforced copper matrix composites were prepared by foil-fiber-foil method (FFF) and, fiber-coating method (MCF) with and without a Ti6Al4V interlayer, respectively. The copper coating was prepared by different electroplating processes and the Ti6Al4V interlayer by magnetron sputtering. The results show that the tensile strengths of specimens without Ti6Al4V interlayer are nearly identical and poor, between 250 and 290 MPa, while the ones of specimen with Ti6Al4V interlayer can be greatly improved, over 500 MPa. This great increase attributes to the improvement of the SiC/Cu interfacial bonding strength because the interfacial reactions occur at Cu/Ti6Al4V interface and Ti6Al4V/SiC interface. Additionally, there are generally many micropores produced by hydrogen and oxygen in the electroplated coating, which would influence the density of the matrix. Therefore, the densification of the matrix was worth investigating since it would influence the thermal and electrical conductivity of the composite, though it has only a little contribution to the tensile strength. Experiments indicate that proper heat-treatment before hot pressing could improve the densification of the matrix.