• Title of article

    Reactive diffusion under Laplace tension

  • Author/Authors

    Ene، نويسنده , , C. and Nowak، نويسنده , , C. and Oberdorfer، نويسنده , , Paulo C. and Schmitz، نويسنده , , G.، نويسنده ,

  • Issue Information
    دوماهنامه با شماره پیاپی سال 2009
  • Pages
    7
  • From page
    660
  • To page
    666
  • Abstract
    Nanostructures such as nanospheres or nanowires may contain surfaces and interfaces of pronounced curvature. To investigate the impact of severe curvature on the kinetic of reactions, thin-film Al/Cu/Al and Cu/Al/Cu triple layers are deposited on tungsten tips of 25 nm curvature radius. The thermal reaction of the layer structure is studied by atom probe tomography. Experiments demonstrate that the reaction rate depends significantly on the deposition sequence of metals. Interpretation of the observed reaction kinetics leads to the conclusion that under the influence of interfacial tension probably the two limiting cases of atomic transport, Darken and Nernst–Planck kinetics, are realized in dependence on the stacking sequence.
  • Keywords
    Reactive interdiffusion , nanospheres , Nernst–Planck coefficient , Atom probe tomography , Al/Cu
  • Journal title
    Ultramicroscopy
  • Serial Year
    2009
  • Journal title
    Ultramicroscopy
  • Record number

    2157596