Title of article :
Microelectrical characterizations of junctions in solar cell devices by scanning Kelvin probe force microscopy
Author/Authors :
Jiang، نويسنده , , C.-S. and Ptak، نويسنده , , A. and Yan، نويسنده , , B. and Moutinho، نويسنده , , H.R. and Li، نويسنده , , J.V. and Al-Jassim، نويسنده , , M.M.، نويسنده ,
Issue Information :
دوماهنامه با شماره پیاپی سال 2009
Pages :
6
From page :
952
To page :
957
Abstract :
Scanning Kelvin probe force microscopy was applied to the microelectrical characterizations of junctions in solar cell devices. Surface Fermi-level pinning effects on the surface potential measurement were avoided by applying a bias voltage (Vb) to the device and taking the Vb-induced potential and electric field changes. Two characterizations are presented: the first is a direct measurement of Bi-induced junction shift in GaInNAs(Bi) cells; the second is a junction-uniformity measurement in a-Si:H devices. In the first characterization, using Bi as a surfactant during the molecular beam epitaxy growth of GaInNAs(Bi) makes the epitaxial layer smoother. However, the electrical potential measurement exhibits a clear Bi-induced junction shift to the back side of the absorber layer, which results in significant device degradation. In the second characterization, the potential measurement reveals highly non-uniform electric field distributions across the n–i–p junction of a-Si:H devices; the electric field concentrates much more at both n/i and i/p interfaces than in the middle of the i-layer. This non-uniform electric field is due possibly to high defect concentrations at the interfaces. The potential measurements further showed a significant improvement in the electric field uniformity by depositing buffer layers at the interfaces, and this indeed improved the device performance.
Keywords :
atomic force microscopy , Microscopic methods , Specifically for solid interfaces and multilayers
Journal title :
Ultramicroscopy
Serial Year :
2009
Journal title :
Ultramicroscopy
Record number :
2157650
Link To Document :
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