Effect of holding time on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

The microstructural development and mechanical properties of a tungsten/ferritic steel diffusion joint with a Ni interlayer, bonded at 900 °C under vacuum for 0.5–2 h, were investigated. Cross-sectional images of the W/Ni diffusion zone indicate the presence of a Ni-rich solid solution, Ni(W), for holding times up to 1.5 h. However, an intermetallic compound Ni4W grew as a distinguishable layer between the W and Ni(W) when the holding time was increased to 2 h. The growth behavior of diffusion layers and their growth mechanism is discussed. On the other hand, smooth changes in concentration of various elements across the Ni/steel interface were observed for the joints annealed at the holding time studied. An average bond strength of 215 MPa was obtained for the joint bonded for 1 h; this bond strength decreased as holding time increased. Variations in the strength of the joints was significantly related to the microstructural development of the diffusion zone. The formation of Ni4W and a solid solution phase enhanced hardness at the interfaces but reduced strength of the joints.