Title of article :
Atomic simulation of grain boundary sliding in Co/Cu two-phase bicrystals
Author/Authors :
Yuasa، نويسنده , , Motohiro and Nakazawa، نويسنده , , Takumi and Mabuchi، نويسنده , , Mamoru، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Abstract :
Molecular dynamic simulations of grain boundary sliding were performed on Cu/Cu one-phase bicrystal and Co/Cu two-phase bicrystal models. The grain boundary sliding and migration behaviors of the Co/Cu bicrystals were different from those of the Cu/Cu bicrystals, and the Co/Cu sliding behavior was less related to the free volume, than that of Cu/Cu. In the Co/Cu(2 2 1) grain boundary model, the pore structure units were formed on the Cu side very near the Co/Cu interface, not just at the interface. The onset of grain boundary sliding in the Co/Cu bicrystals was due to the uncorrelated atomic shuffling induced by the pore structure units.
Keywords :
Copper , Molecular dynamics , Grain boundary structure , grain boundary sliding
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Journal title :
MATERIALS SCIENCE & ENGINEERING: A