Title of article :
Microstructure; bonding strength and thickness ratio of Al/Mg/Al alloy laminated composites prepared by hot rolling
Author/Authors :
Zhang، نويسنده , , X.P. and Yang، نويسنده , , T.H. and Castagne، نويسنده , , S. and Wang، نويسنده , , J.T.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
7
From page :
1954
To page :
1960
Abstract :
In this study, 7075 Al/AZ31B Mg/7075 Al laminated composites were prepared by hot roll bonding method. Microstructure and bonding strength of the experimental laminated composites, and thickness ratio of the constituent layers after hot rolling were evaluated. Effects of reduction ratio and rolling temperature on the microstructure, bonding strength and thickness ratio were also studied. Dynamic recrystallization microstructures were observed in the composite. The bonding strength decreased with reduction ratio and rolling temperature due to the increase in the grain size and diffusion layer width with the reduction ratio and rolling temperature. The maximal bonding strength of the experimental laminated composite was 66 MPa. The thickness fraction of the Mg alloy plate after hot rolling decreased with the reduction ratio and rolling temperature.
Keywords :
Hot Rolling , Reduction ratio , Bonding strength , Thickness ratio , microstructure
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2011
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2163594
Link To Document :
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