Shock compression of monocrystalline copper: Experiments, characterization, and analysis

Monocrystalline copper samples with [0 0 1] and [2 2 1] orientations were subjected to shock/recovery experiments at 30 and 57 GPa and 90 K. The slip system activity and the microstructural evolution were investigated. Different defect structures, including dislocations, stacking faults, twins, microbands, and recrystallized grains were observed in the specimens. The residual microstructures were dependent on crystalline orientation and pressure. The differences with crystalline orientations are most likely due to different resolved shear stresses on specific crystalline planes. The geometric relationships between the shock propagation direction and crystalline orientation are presented under uniaxial strain. It is shown that the [2 2 1] orientation, by virtue of having fewer highly activated slip systems, exhibits greater concentration of deformation with more intense shear on the primary system. This, in turn leads to greater local temperature rise and full recrystallization, in spite of the thermodynamic residual temperature of ∼500 K and rapid cooling (within 20 s) to ambient temperature. The profuse observation of microbands is interpreted in terms of the mechanism proposed by Huang and Gray [J.C. Huang, G.T. Gray III, Acta Metallurgica 37 (1989) 3335–3347].