Void evolution in nanocrystalline metal film under uniform tensile stress

A theoretical model to describe the nucleation and growth of voids at triple junctions of nanocrystalline metal film under uniform tensile loading is suggested. The void growth rate controlled by grain boundary diffusion under the combined influence of void surface energy, grain boundary interface energy and elastic energy stored in the solid is evaluated. Stress relaxation during uniform tension deformation is finally discussed; the effective stress relaxation distance is also calculated. The stress relaxation not only suppresses the nucleation of voids and cracks, but also influences the void growth rate.