The preparation and performance of a novel room-temperature-cured heat-resistant adhesive for ceramic bonding

A novel adhesive for joining ceramic materials was made using silicon–epoxy interpenetrating polymer networks (IPNs) as matrix (based on silicon resin (SR) and diglycidyl ether of bisphenol A (DGEBA) epoxy resin (EP)), γ-glycidoxypropyltrimethoxysilane (γ-GPS) as cross-linking agent, dibutyltin dilaurate (DBTDL) as catalyst, Al, low melting point glass (GP) and B4C powders as inorganic fillers, low molecular polyamide (LMPA 650) as curing agent. The character and heat-resistance property of the IPNs and adhesive were tested by FT-IR, DSC and TG. The compressive shear strength of ceramic joints was investigated at different temperatures in atmosphere surroundings. The modification mechanism of inorganic fillers was studied using XRD. Results showed that the IPNs were a homogeneous morphology of inter-crosslinked network structure with single Tg. The adhesive could be cured at room temperature with good heat-resistance property due to the chemical bond of epoxy group and Si–O–Si. The optimum compressive shear strength (9.44 MPa at 1000 °C) occurred at SR/EP ratio: 9/1, content of KH560: 2%, Al/GP/B4C ratio: 3.2/4/3, fillers/IPNs ratio: 6/4. The adhesive had good heat-resistance property with 10% weight loss at 435 °C. Failure mode of joint was mixing failure due to the high chemical bonding force.