Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a SnAgCu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study.