Title of article :
Low temperature creep of hot-extruded near-stoichiometric NiTi shape memory alloy part I: Isothermal creep
Author/Authors :
Raj، نويسنده , , S.V. and Noebe، نويسنده , , R.D.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Pages :
9
From page :
145
To page :
153
Abstract :
This two-part paper is the first published report on the long term, low temperature creep of hot-extruded near-stoichiometric NiTi. Constant load tensile creep tests were conducted on hot-extruded near-stoichiometric NiTi at 300, 373 and 473 K under initial applied stresses varying between 200 and 350 MPa as long as 15 months. These temperatures corresponded to the martensitic, two-phase and austenitic phase regions, respectively. Normal primary creep lasting several months was observed under all conditions indicating dislocation activity. Although steady-state creep was not observed under these conditions, the estimated creep rates varied between 10−10 and 10−9 s−1. The creep behavior of the two phases showed significant differences. The martensitic phase exhibited a large strain on loading followed by a primary creep region accumulating a small amount of strain over a period of several months. The loading strain was attributed to the detwinning of the martensitic phase whereas the subsequent strain accumulation was attributed to dislocation glide-controlled creep. An “incubation period” was observed before the occurrence of detwinning. In contrast, the austenitic phase exhibited a relatively smaller loading strain followed by a primary creep region, where the creep strain continued to increase over several months. It is concluded that the creep of the austenitic phase occurs by a dislocation glide-controlled creep mechanism as well as by the nucleation and growth of deformation twins.
Keywords :
Intermetallic alloys , Low temperature creep , NiTi , Shape memory alloys
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2013
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2173766
Link To Document :
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