Title of article
Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation
Author/Authors
Zhou، نويسنده , , Yanguang and Yang، نويسنده , , Zhenyu and Lu، نويسنده , , Zixing، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2014
Pages
9
From page
116
To page
124
Abstract
Grain boundaries (GBs) dependent crack propagation has been observed in previous experiments, which shows strong anisotropy of cracks propagation behaviors in nanocrystalline. In this paper, the propagation behaviors of central cracks at different symmetrical tilt GBs in bicrystalline copper are studied by using atomistic simulations. Three different modes of interfacial crack propagation are found: crack prefers to propagate in a brittle manner along GB; crack propagates with voids and coalescence ahead of the crack tip, and blunts in the opposite direction; crack blunts at both two tips of the crack. Furthermore, thermo effects on the crack propagation are also investigated in our simulations. It is found that the mode of crack propagation at a certain GB changes from brittle to ductile at a critical temperature, which is different for the GB with different crystalline structures.
Keywords
dynamic crack propagation , Grain boundary , Brittle to ductile , Thermo effects , Molecular dynamics
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2014
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2175258
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