Enhancing fatigue cracking resistance of nanocrystalline Cu films on a flexible substrate

We clearly show that fatigue-induced grain growth is suppressed in the annealed nanocrystalline Cu films, which leads to the enhanced resistance to fatigue cracking compared with that of the as-deposited ones. Annealing-stabilization of the nanograin boundaries may provide a potential way to enhance fatigue reliability of nanoscale film-based flexible devices.